Photolithography
Lithography is carried out using a Karl-Suss MA6 mask aligner, which can accept substrates ranging from small fragments to 100 mm diameter wafers. 150 mm wafers could be accomodated by the simple addition of a larger chuck.
Using HPR504 positive resist, feature sizes as small as 0.8 碌 have been printed using chrome masks. With masks produced in house at 杏吧原创 the useful minimum feature size is 2.5 碌, with 2.5 碌 minimum spacing and level-to-level registration.